At the heart of every electronic device lies a printed circuit board. These boards are made of several electronic components that emit electromagnetic signals. These signals can cause interference with other devices and, as a result, negatively impact their performance. Several techniques have been implemented to mitigate this interference, and popular amongst all is the board level EMI shielding. The use of board level EMI shielding has become highly popular owing to its capability of protecting the circuit board and its components from unwanted electromagnetic interference. The shielding is achieved through the application of conductive and/or magnetic materials on the board or component, which successfully absorbs or redirects the EM signals. Whether it is in healthcare, aerospace, automotive, or even military applications, the use of board level EMI shielding has been widespread.
That being said, the cost of board level EMI shielding can be expensive. However, the cost of not using EMI shielding can result in even greater expenses. Without such an effective barrier, your electronic devices are vulnerable to the harmful effects of electromagnetic interference, which can result in glitches, data loss, and even complete device failure. As the demand for EMI shielding continues to increase, manufacturers are actively seeking ways to mitigate the costs involved in making the shields. With constant trial and error, manufacturers could find certain techniques that significantly helped them to reduce the cost of EMI shielding. Read on the post to know more!
3 Popular Strategies to Reduce EMI Shielding Costs
While the initial cost of EMI shielding may be a concern for some companies, it is important to remember that it is an investment in long-term equipment protection. The ongoing operational costs are minimal compared to the potential losses incurred from repairing damaged equipment and experiencing downtime. Many techniques can be implemented to reduce the overall cost of EMI Shielding and the following are three popular ones among them:
- Use of Alternate Materials: In order to achieve optimal cost efficiency, one highly popular method the manufacturers implement is altering the composition of materials. This may involve substituting materials or applying a different construction approach. The type of alloy implemented is an influential factor in determining the cost of EMI shielding. Those alloys that possess high levels of nickel tend to be more expensive, thus opting for those with lower nickel counts can prove cost-saving. Overall, the goal is to find the right balance of cost and performance for each specific application.
- Reduce Overall Thickness: The other effective strategy to decrease the cost of EMI shielding is to lower the thickness of the board. This can be achieved through different methods, such as reducing the dielectric material's thickness, using thinner shielding material, or decreasing the number of shielding layers. Thinning out your EMI shielding also helps reduce the weight and volume of the board, resulting in significant cost savings. Reducing overall thickness presents a valuable way to manage cost while maintaining effective EMI shielding.
- Simplify the Shielding Process: Optimizing the shielding process can greatly reduce both time and costs. While traditional methods for creating EMI shielding still exist, they often involve complicated techniques and specialized tools. As a result, larger shields can be particularly costly and time-consuming to produce. Simplifying designs while maintaining high quality is recommended for achieving efficient and cost-effective results in the shielding process.
EMI shielding is crucial in safeguarding electronic devices from potential interference. However, it can be quite expensive for companies to implement such measures. In this case, the companies can source these EMI shielding solutions from trusted manufacturers. XGR Technologies provide SnapShot board level EMI shields that are designed to solve many challenges associated with today’s board level shielding technologies. These shields feature a non-conductive, polyetherimide inner surface and a tin-plated outer surface. The inner surface is non-conductive and the outer one is conductive, which results in exceptional shielding performance in low-profile solution.
