Board Level Shielding for FPGA and Microcontroller Applications

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Field Programmable Gate Arrays (FPGAs) and microcontrollers are two critical building blocks in modern electronic systems. They provide programmable logic, processing capabilities and integrated computing and control functions, allowing designers to create custom functionalities. Having said this, these critical componenst are susceptible to EMI due to their high-speed operation and the complexity of their designs. These devices produce electromagnetic emissions that can interfere with nearby components or systems, leading to performance degradation, timing errors, data corruption, and even system failures. Also, they are vulnerable to external electromagnetic sources like radio frequency signals, power line disturbances, or electrostatic discharges.

To solve these challenges, designers employ several techniques to reduce EMI and enhance electromagnetic compatibility (EMC). One of the commonly used approaches is ensuring proper PCB layout and grounding techniques. Other methods such as implementing proper signal and power integrity by reducing trace lengths, using appropriate decoupling capacitors, and separating analog and digital sections, and implementing different types of shielding solutions. This post discusses these techniques and helps you understand how board level shields help to mitigate the effects of EMI in FPGAs and microcontrollers.

Types of Shielding Techniques for FPGA and Microcontroller Applications:

There are several types of shielding techniques commonly used in FPGA and microcontroller applications. Here are the three commonly used techniques listed.

  • Can Shields: Metal enclosures known as can shields are used to provide complete protection to electronic components by creating a Faraday cage. These shields are typically constructed using materials like aluminum, steel, or copper. The primary purpose of can shields is to effectively block high-frequency electromagnetic waves and prevent external electromagnetic interference from entering the electronic system. It is crucial for can shields to be properly grounded in order to dissipate any trapped electromagnetic energy and ensure optimal shielding effectiveness. By employing well-designed can shields, organizations can significantly reduce EMI and enhance the overall performance and reliability of FPGA and microcontroller systems.
  • Copper Foil Shields: Copper foil shields comprises a thin copper tape layer that is applied to the outer surface of electronic components or circuits. This shielding method is frequently employed in scenarios where space constraints exist or a flexible shielding solution is demanded. Copper foil shields can easily conform to the shape of the component or circuit, offering an impressive level of defense against electromagnetic interference (EMI) and radio frequency interference (RFI). In addition, these shields can be effortlessly linked to the ground plane, thereby augmenting their effectiveness in shielding Field Programmable Gate Arrays (FPGAs) and microcontrollers.

  • Conductive Coatings: Applying a conductive material layer to electronic components or circuits is known as conductive coatings. The purpose of these coatings is to create a protective barrier that either reflects or absorbs electromagnetic waves, thereby minimizing interference with the electronic system. Typically, conductive coatings are used in conjunction with other shielding methods to ensure comprehensive protection for FPGA and microcontroller systems from EMI and RFI.

  • Conductive Coatings: These shields are made of conductive materials and act as a Faraday cage around the sensitive components, containing the electromagnetic energy within the system and minimizing interference with other devices.

    When choosing shielding techniques for FPGA and microcontroller applications, it is crucial to consider the system's specific requirements and constraints. Factors such as the operating frequency, space limitations, and cost considerations play a significant role in determining the most appropriate shielding solution. Careful consideration of these factors ensures that the chosen technique effectively meets the needs of the application.

    Board level shielding soluitons have emerged as the most popular choice for shielding for FPGA and microcontroller applications due to the benefits they offer. If you have been considering them for your FPGA and microntroller applications then you can consider SnapShotBoard Level EMI Shield developed by XGR Technologies. Featuring non-conductive, polyetherimide inner surface and conductive, tin plated outer surface, these shields offer exceptional shielding performance in an ultra-lightweight and low profile solution. Contact us today to discuss your requirements for board level shielding for FPGA and microcontroller applications.

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    Jon Buchwald

    Jon Buchwald

    Jon Buchwald is the VP of Sales & Marketing at XGR Technologies, specializing in board level EMI shields. Jon is passionate about delivering innovative EMI shielding solutions to address unique design challenges. He is dedicated to providing top-notch customer service and building strong partnerships within the electronics and engineering community. For inquiries or collaborations, connect with Jon on LinkedIn https://www.linkedin.com/in/jon-buchwald/  or email at sales@xgrtec.com.