A system-in –a-package (SiP) or system-in-package has gained immense popularity in recent years, as it supports miniaturization and performance. It features several integrated packages, which are enclosed in carrier chips that are stacked using PoP. The SiPs are commonly used in electronic devices like digital music players, mobile phones, wearable devices, and so on. The demand for denser SiP packages has increased in recent years. These packages comprise several chips, which perform different functions. There are also dual-side assemblies, which enable PCB designers to make the best use of the available space. Although designed for high performance, these chips and components of dual- side assemblies may interfere with each other’s performance causing damage. To avoid this, nowadays, PCB designers are using board-level compartmental shielding technologies. These technologies help avoid chip interference and ensure the high performance of these packages. This post explores the reasons for the popularity of SiPs and the requirement for board-level shielding in detail.
7 Reasons Why SiPs are in Demand
The following are 7 key benefits offered by SiPs, which have contributed to their increasing popularity in electronic devices
- Miniaturization: All modern IoT-enabled devices require miniaturization. Although PCB technologies have evolved over the years, the integration of passive components has been challenging. Designing and maintaining their sizes have been difficult. However, system-in-packages ensure the integration of passive components and have helped reduce the overall size of the gadget or system by at least 65%.
- Integrated Packages: SiPs can incorporate various silicon technologies, die geometries, and chips from different packages. These packages include various high-speed designs, too.
- Easily Upgradeable: The SiPs can be easily upgraded using die shrinks, which makes them more appreciable than other PCB technologies.
- Reduced Chances of Failure: SiP packages help reduce the chances of failure, as they help reduce the number of solder joints. Multiple solder joints can be replaced with a single joint. The SiPs are generally encapsulated, which helps ensure strong solder joints, which are protected from environmental conditions. All these help reduce the chances of failure.
- Reduced Supply Chain Costs: Earlier miniature PCB designs demanded components from multiple manufacturers. However, SiPs have helped replace those multiple components with a single component. This would mean PCB assembly services have to deal with fewer suppliers and even fewer components, which helps them save on supply chain costs and focus on more valuable tasks.
- Increased Time-to-Market: SiPs have helped OEMs to accelerate their time-to-market capabilities. There is multifold reduction in a number of components used for assembly. This helps reduce the overall assembly time. There is less labor required and OEMs can easily accelerate their time-to-market.
- Reduced PCB Costs: As mentioned before, SiPs use minimal components, which helps lower the cost of production. According to various studies, these packages can easily help reduce your PCB manufacturing costs by 30% to 50%.
The above advantages can be augmented by using SnapShot board level shielding by XGR Tech. These board level shielding solutions are made of thermoformed plastic base material with tin plating. These shielding solutions can be thermoformed into any shape, which means they can be designed to fit your SiP package. SnapShot board level shields are attached to PCBs or SiP packages by snapping over solder spheres located at the perimeter of the shield. These shielding solutions can be operated continuously at high temperatures up to 170 degree Celsius. Zero clearance is required between the shield and the component, which makes it easy to achieve the lowest profile shield. SnapShot board level shields have been successfully used in several mission-critical applications such as military and industrial handheld radios, military and industrial drones, industrial handheld scanners, and missile nose cones experiencing forces up to 17000 Gs. You can get in touch with our experts to understand the possibility of using SnapShot for board level shielding of SiPs. Our experts will help you understand the benefits of this shielding type and how it can optimize the performance of any SiP.
