Low Profile Board Level EMI Shields
SnapShot board level EMI shield technology offers the lowest profile board level shield available on the market today.
SnapShot EMI shields are manufactured from a proprietary material comprised of a 0.125mm (5 mils) thick film of polyetherimide that is tin plated to a thickness of 5 microns on one side. This tin-plated surface acts as the conductive layer connecting to the ground plane to complete the Faraday cage.
Because the SnapShot board level EMI shield is tin-plated on only one surface, the other surface (the inner shield surface) is non-conductive polyetherimide. The result is a board level EMI shield that can be designed with a height equal to the height of the tallest component with no concern of creating a short circuit.
And, each SnapShot shield is custom designed and manufactured through our thermoforming process which enables a contoured profile to match the height profile of the board layout.