Low Profile Board Level EMI Shields

Low Profile Board Level EMI Shields

SnapShot board level EMI shield technology offers the lowest profile board level shield available on the market today.

SnapShot EMI shields are manufactured from a proprietary material comprised of a 0.125mm (5 mils) thick film of polyetherimide that is tin plated to a thickness of 5 microns on one side. This tin-plated surface acts as the conductive layer connecting to the ground plane to complete the Faraday cage.

Low Profile Board Level EMI RF Shields

Because the SnapShot board level EMI shield is tin-plated on only one surface, the other surface (the inner shield surface) is non-conductive polyetherimide. The result is a board level EMI shield that can be designed with a height equal to the height of the tallest component with no concern of creating a short circuit.

 

SnapShot EMI Shield Vs Traditional Frame and Lid

And, each SnapShot shield is custom designed and manufactured through our thermoforming process which enables a contoured profile to match the height profile of the board layout.

 

Snapshot EMI Low Profile Shields
SnapShot EMI Shield Vs Traditional Frame and Lid

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