Fifth generation or 5G is a new generation mobile network and a wireless standard after 4G. This technology goes beyond phones and connects various types of devices at a high speed and signal strength. It encompasses advanced applications such as AI and IoT that finds uses in automation across industries. By and large, 5G has revolutionized wireless communication, enhanced data speeds, lowered latency, and increased network capacities. However, this technology involves high-frequency signals which are bound to cause electromagnetic interference. Hence, this is one of the challenges 5G needs to overcome to retain signal strength, bandwidth, and high-speed connectivity. This EMI can be produced from cables, devices, as well as printed circuit boards embedded in them. The board level EMI can be overcome by using EMI shields, which in turn benefits and protects the device. So, how do we implement board level shielding for 5G applications effectively? This post discusses the same.
Understanding the Significance of Board Level Shielding in 5G
5G systems operate at higher frequencies, which are more susceptible to interference and signal losses. Board level shielding is essential to mitigate electromagnetic interference (EMI) and maintain signal integrity as 5G communication implies seamless and high-speed connectivity. PCB shielding solutions help contain EMI within devices, prevent interference from external sources, and minimize the impact of EMI on sensitive components. Earlier enclosures were used to cover the boards which added their weight to the device. Also, this increased the rigidity of the boards. Nowadays, flexible shields made of plasticized metal are considered for the purpose. With a huge demand for small-sized and lightweight components and devices in the telecom sector, flexible, lightweight shields that can be cut to the board’s shape and dimensions are any time effective. Careful placement and layout of board level shields are critical for optimizing EMI mitigation in 5G applications.
Tips to Overcome EMI Challenges in 5G Applications
High frequency bands and complex modulation schemes lead to the possibility of electromagnetic interference in 5G applications. Increased uses of multiple input multiple output (MIMO) systems, increased component density in confined spaces on boards, and design complexities of 5G devices increase the potential for EMI and cross-talk between adjacent components. Effective board level shielding is essential to mitigate these challenges. Overcoming EMI challenges in 5G devices will fulfill its objectives such as achieving multi-Gbps peak data speeds without signal losses, low latency, huge network bandwidth, device communication in IoT, and so on. Here are some key factors that may help overcome EMI challenges in 5G devices.
- Identifying and shielding important and sensitive components such as RF transceivers, power amplifiers, oscillators, and high-speed interfaces is a crucial step in mitigating EMI. Proper shielding placement minimizes the impact of EMI on these components and preserves their performance.
- Proper positioning and layout of the EMI shield ensures improved signal integrity and propagation.
- Thermal management is crucial for heat dissipation and overheating of components can be prevented with proper ventilation. This is especially crucial for 5G network devices as are used in high-power and high-speed applications.
- Proper grounding, routing techniques, and isolation between sensitive traces are essential to maintain signal quality.
Shielding Techniques for 5G Applications
These are some types of shielding techniques used to prevent EMI at board level.
- PCB Shielding Cans: These are conductive metal cans or enclosures to shield critical components or areas on the PCB. They isolate circuits by generating a Faraday cage on the board. While these are cost effective, PCB shield cans are not suitable for board that may need rework. Also, they are not suitable for intricately designed 5G device boards.
- Clip-on Shields: These are shields with a removable lid and small pins. However, they occupy space and hence are not suitable for today’s compact-sized devices.
- Copper Foil Shields: Copper foil shields are placed on specific areas on the board to be able to cater to signal losses and EMI. However, this does limit the bendability factor and there are some other drawbacks too.
- Plasticized Shields: These are made of plasticized metal with an outer plastic surface and the inner surface being conductive. They can cater to today’s boards in all ways such as size, EMI mitigation, heat dissipation, flexibility, compactness, cost effectiveness, signal propagation, and so on.
Efficient board level shielding solutions are crucial for effectively managing EMI challenges in 5G applications. Hence, it is essential to use reliable shields made by reputed and certified manufacturers. This can be done after a detailed requirement gathering process, followed by placement and layout considerations, selecting the right shielding materials, and manufacturing shields of required shape and dimensions. Thorough testing and validation is also an important step in this process. An accurately implemented board level shielding paves way for efficient and robust 5G communication networks and enables optimal utilization of this revolutionary and transformative technology.
If you are an electronics manufacturer developing PCBs for 5G applications, you will need PCB shields that not only mitigate EMI but also fit into compact spaces on small boards. XGR Technologies offers SnapShot™ EMI shields that are lightweight, flexible, and offer isolation for a wide frequency range from below 1 GHz to 12 GHz. They are made of plasticized metal, and hence they stay firmly in place while also being bendable. You can contact the XGR Technologies team today if you are interested in knowing more about these EMI shields or sharing your requirements.
