How Board Level Shields Can Impact the Weight and Size of Devices

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As technology continues to evolve, there is an increasing demand for smaller and lighter devices that can deliver optimum level of performance, without adding to the overall device footprint. Among various factors, the one factor that often affects the weight and size of electronic devices is the use of components for its performance. These components may be current carrying or used for shielding electromagnetic interference or other types of interference. Board level shields are such components that play a significant role in safeguarding sensitive components from electromagnetic interference (EMI), but they can also have an impact on the overall weight and size of the device. In this post, we will explore how board level shields can contribute to reducing device weight and size, and why manufacturers should pay attention to this aspect during the design process.

    Can Board Level Shileds Help Achive Reduction in Size and Weight?

  • Board level shields can have a significant impact when it comes to minimizing the weight and size of electronic devices. There are several ways in which these shields can have an impact, which are listed below.
  • Board level shields serve as barriers, preventing external EMI from negatively affecting the functioning of sensitive components on the circuit board. By minimizing the need for additional protective measures, like bulky shielding enclosures, these shields contribute to a significant reduction in the overall weight and size of the device.
  • The modern board level shields are crafted to seamlessly blend with the circuit boards' dimensions. Their compact design ensures optimal space allocation for shielding, considerably reducing the device's overall footprint.
  • Board level shields can also help enhance the placement of electronic components on the circuit board. By offering a physical barrier between sensitive components, these shields contribute to preventing crosstalk and interference, enabling more efficient use of board space. This helps in reducing the overall size of the device.
  • Board level shields offer an additional layer of protection to the electronic components, safeguarding them from environmental factors and other potential damages. By integrating this protection directly onto the circuit board, the demand for external protective casings or enclosures can be minimized. This reduction in external housing materials leads to a decrease in device weight and size.
  • Board level shields were traditionally made using steel, aluminum or copper. Although aluminum is lightweight, it may sometimes add up to the weight when other weighter components are added to the board. This is where hybrid materials like metallized plstic shields can help. These materials not only provide high levels of EMI shielding effectiveness but also highly contribute to keeping the weight of the shield minimal while offering the same reliability and durability as a metal shield. This choice of materials further contributes to reducing device weight and size.

To conclude, board level shields are a vital component in electronic devices, safeguarding against EMI and RFI. While they can add weight to the device in certain scenarios, they also contribute to overall size reduction and allow for more efficient use of board space if you make wise choices. If you have been considering specialized board level shields that can seamlessly integrate to your device design, then get in touch with an expert in board-level EMI shielding like XGR Technologies. The company provides SnapShotBoard Level EMI Shield that is made of metallized plastic material that can be easily thermoformed into any design. These shields feature non-conductive, polyetherimide inner surface and conductive, tin plated outer surface resulting in exceptional shielding performance in an ultra-lightweight and low profile solution.

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Jon Buchwald

Jon Buchwald

Jon Buchwald is the VP of Sales & Marketing at XGR Technologies, specializing in board level EMI shields. Jon is passionate about delivering innovative EMI shielding solutions to address unique design challenges. He is dedicated to providing top-notch customer service and building strong partnerships within the electronics and engineering community. For inquiries or collaborations, connect with Jon on LinkedIn https://www.linkedin.com/in/jon-buchwald/  or email at sales@xgrtec.com.